The measured normal grinding force was greater than the tangential grinding force and the fluctuations in the data collected in the SA direction were smaller than those in the SB direction see Fig 11 Due to the combined characteristics of the two phase material the carbon fiber in the SB direction grinding direction perpendicular to the
The model was finally validated by the orthogonal grinding experiment of powder metallurgy nickel based superalloy FGH96 by using the electroplated CBN abrasive wheel Grinding force values of prediction and experiment were in good consistency The errors of tangential grinding force and normal grinding force were % and % respectively
tNM Matrix elements of tangential grinding force N M Frequency number/row number of the matrix N Fourier series number/column number of the matrix V 0 Relative movement speed mm s −1 V 0x X direction relative movement speed mm s −1 V 0y Y direction relative movement speed mm s −1 V s Wheel speed mm s
It was verified that the developed abrasive tool possessed the grinding characteristics of high tangential grinding force and low normal grinding force After grinding of silicon specimens for 120 min the value of surface roughness decreased from to nm under the selected grinding conditions The surface quality of the silicon
Force modeling of vertical surface grinding considering wheel workpiece contact geometry Author links open overlay panel Binhua Gao a Tan Jin b Meina Qu c Ping Li b d Guizhi Xie b Zhentao Shang b This degree can be quantified by the infeed angle ξ i which is defined by the radial and tangential velocity of material flow relative to
Improving the optical properties of the optical materials by using ceramic based grinding wheel and centerless grinding process is one of the practical engineering methods to solve the issues of microdiameter precision grinding of YAG Y 3 Al 5 O 12 optical crystal is a new substrate and UV and infrared optical window materials whose
Grinding is a frequently used manufacturing process to produce finished components of desired shape size and accuracy This uses multiple point cutting tools to remove the unwanted materials from the stock in the form of chips Komanduri 1993 Earlier researchers have classified grinding as Form Finish Grinding FFG and Stock Removal Grinding SRG
In the grinding process the normal and tangential grinding forces F n and F t were recorded by a KWR75E six axis dynamometer Kunwei Technology Co Ltd Beijing China with a sampling frequency of 1000 Hz The LDED specimens and the dynamometer were connected together by clamps and fixed on the workbench of the surface grinding machine
The grinding process consists of three main stages sliding friction ploughing and cutting so the tangential and normal forces of grinding are broken down into friction force ploughing force and cutting force respectively [24] 3 F t = f t F tp F tc 4 F n = f n F np F nc Where f t is the tangential friction force F tp is the
The normal and tangential grinding forces in TUVAGG were lower by % and % respectively than conventional gear grinding CGG Besides the grinding temperature and surface
Single crystal silicon a typical hard and brittle material is widely used in various fields due to its exceptional material properties However grinding of silicon is facing great challenges such as surface and subsurface damages due to the hardness and brittleness of the material To increase the grinding force ratio of tangential to normal force and enhance
As can be seen from Table 7 the optimal combinations of process parameters for normal and tangential grinding forces under 2D ultrasonically assisted grinding and conventional grinding conditions of C f /SiC were the same for A1B1C1 a line speed of m/s a feed rate of 5 mm/min
The tangential grinding force model and normal grinding force model are formulated on the Simulink that is Eq 1 and Eq 2 The following 8 circuit diagram shows the tangential and normal grinding forces of the formulated circuit in Simulink and check with experimental results Jinyuan Tanga et al 2009 Table 1 Experimental Data V s m/s
According to the relative motion of the workpiece to the grinding wheel three types of centerless grinding operations can be performed in the proposed method as shown in Fig 1 a tangential feed type in which initially the grinding unit is located in the down left side of the grinding wheel with a distance that is large enough for loading the workpiece on the upper
The normal and tangential grinding forces in TUVAGG were lower by % and % respectively than conventional gear grinding CGG Besides the grinding temperature and surface
The tangential force signals at different grinding depths are shown in Fig 14 from which it can be seen that the tangential force signals at 1 µm grinding depth are more uniform whereas the tangential force signals at 2 µm grinding depth show a part of high points and the tangential force signals at 3 µm grinding depth have more such
Taking the grinding speed v s = 39 m/s as an example the normal and tangential grinding force at different material removal depths reduced 51% 40% 32% 27% 27% 15% and 9% and 50% 44% 39% 30% 26% 22% and 12% respectively The ablated groove under the selected laser processing parameters was 65 μm of a V shape profile so the
However grinding cracks grinding burns work hardening and wheel blockage always occur in traditional grinding due to excessive normal force For nicked based superalloy the normal grinding forces are dozens or even hundreds of times the tangential grinding force which are more easily encountered in the above mentioned problems [4 5 6
Back in 1950 Salje 23 proposed a model for the tangential grinding force based on the shear strength of the workpiece material depth of cut and width of cut Based on this other process parameters 24 such as equivalent grinding wheel diameter 25 grinding wheel speed 26 and workpiece feed speed 27 are also taken into account In general
Tangential grinding forces recorded for various cooling lubrication conditions In grinding the fluid droplets from MQL technique are applied directly onto the abrasive wheel surface Therefore a lubrication film is produced which get higher with the increase of the flowrate from 30 to 120 mL/h Thus friction is reduced in the wheel workpiece
The tangential grinding force F t and the normal grinding force F n basically show a downward trend as the speed of the grinding wheel increases The decrease in grinding force is due to the increase in the speed of the grinding wheel which reduces the depth of cut of the abrasive grains
The tangential grinding force has a similar increasing trend In UVG the normal and tangential grinding force further rises to 318 N and 120 N when the depth of cut increases to mm as the machined surface burnout is not visible under the situation The grinding force in UVG is approximately 41% lower than that in CG
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